Failure Analysis
Failure Analysis
When your ISC products suffer failures, please report to us and we will immediately organize failure analysis.
Contact us:
Phone: +86-510-85346550
Email: 2502525178@qq.com
Failure Analysis Process
1.Accept Failure Products
2.Examine the surface, take photos, and keep record for analysis.
3.Test the electrical parameters, record the test data, and compare the data with product standards.
4.Use ultrasonic equipment to perspective the product inside, will dissect it if needed.
5.Examine the products with microscope to determine any material or technique flaws.
6.Organize discussion
7.Conduct imitation repeat experiment if necessary.
8.Conclude on the failure causes
9.Find correction measures
10.Report to the costumer
![15646503153141065[1].png](/en/static/upload/image/20230911/1694419882706567.png "1694419882706567.png")
![15646503755013685[1].png](/en/static/upload/image/20230911/1694419893147860.png "1694419893147860.png")
![14734015612230710[1].jpg](/en/static/upload/image/20230911/1694419902119482.jpg "1694419902119482.jpg")
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Address: 68 Xinmei Road, WND, Wuxi, Jiangsu, China (214028)
Tel：+86-510-85346350 MP：015961889156 Email：mdh@iscsemi.com
Links：ChipFind ALLDatasheet RightIC IC2China
Address: 68 Xinmei Road, WND, Wuxi, Jiangsu, China (214028)
Tel：+86-510-85346350 MP：015961889156 Email：mdh@iscsemi.com
Links：ChipFind ALLDatasheet RightIC IC2China
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